Method for CPU/heatsink anti-tip and socket damage prevention

ABSTRACT

An information handling system (IHS) includes a heatsink retention apparatus. A processor mounted on a board receives a heatsink base having peripheral, spaced apertures. At least two latching mechanisms include a mounting portion received respectively in peripheral, spaced apertures on opposites sides of the heatsink base. A latching surface is mounted to one of (i) the heatsink base and (ii) a terminal portion of the mounting portion to engage respectively with either the mounting portion or an upper edge of the corresponding peripheral, spaced aperture of the heatsink base. At least two peripheral, spaced loading screws are sized to be engageable by loading nuts when the heatsink base is positioned not higher than the engagement height. The engaged, at least two, latching mechanisms prevent tipping of the heatsink base during loading of the at least two peripheral, spaced loading screws with the at least two spaced apart loading nuts.

RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.15/185,900, filed Jun. 17, 2016, the content of which is fullyincorporated herein by reference.

BACKGROUND 1. Technical Field

The present disclosure relates in general to assembly of heatsinks ontocentral processing units (CPUs), and more particularly to mounting ofheatsink bases that use two loading screws on a board of an informationhandling system (IHS).

2. Description of the Related Art

As the value and use of information continue to increase, individualsand businesses seek additional ways to process and store information.One option available to users is information handling systems (IHSs). AnIHS generally processes, compiles, stores, and/or communicatesinformation or data for business, personal, or other purposes, therebyallowing users to take advantage of the value of the information.Because technology and information handling needs and requirements varybetween different users or applications, IHSs may also vary regardingwhat information is handled, how the information is handled, how muchinformation is processed, stored, or communicated, and how quickly andefficiently the information may be processed, stored, or communicated.The variations in IHSs allow for IHSs to be general or configured for aspecific user or specific use such as financial transaction processing,airline reservations, enterprise data storage, or global communications.In addition, IHSs may include a variety of hardware and softwarecomponents that may be configured to process, store, and communicateinformation and may include one or more computer systems, data storagesystems, and networking systems.

A new industry standard method for heatsink and central processor unit(CPU) loading does not include preloading of the CPU. A heatsink base isloaded at only two load points at midpoints of two long edges. When afirst load screw is applied, certain tolerance conditions can exist thatallow tipping of the heatsink base into a socket that holds the CPU,causing permanent damage. To mitigate this risk, procedural safeguardsare required as an industry solution. Primary screws are added to thecorners of the heatsink base in a prescribed sequence. Sequencing isalso required on removal of the primary screws and the heatsink base.However, a procedural requirement such as sequencing is not a foolproofsolution in high volume manufacturing.

BRIEF SUMMARY

In accordance with the teachings of the present disclosure, aninformation handling system (IHS) includes a heatsink retentionapparatus. A processor mounted on a board receives a heatsink basehaving peripheral, spaced apertures. At least two loading screws aremounted on the board. The loading screws are received respectively in acorresponding pair of the peripheral, spaced apertures on opposite sidesof the heatsink base. At least two latching mechanisms include amounting portion and a latching surface. The mounting portion is mountedto the board. The mounting portion is received, respectively, in anothercorresponding pair of peripheral, spaced apertures, positioned onopposite sides of the heatsink base. The latching surface is mounted toone of (i) the heatsink base, to engage the mounting portion extendingthrough the corresponding peripheral, spaced aperture, as the heatsinkbase is lowered to an engagement height relative to the board and (ii) aterminal portion of the mounting portion to engage an upper edge of thecorresponding peripheral, spaced aperture of the heatsink base. Each ofat least two loading nuts engage a corresponding loading screws. The atleast two loading screws are each sized to be engageable by the at leasttwo loading nuts when the heatsink base is positioned not higher thanthe engagement height. The engaged at least two latching mechanismsprevent tipping of the heatsink base during loading of the at least twoloading screws with the at least two loading nuts.

In accordance with embodiments of the present disclosure, a heatsinkretention apparatus is provided for mounting a heatsink base havingperipheral, spaced apertures onto a processor that is mounted on a boardof an IHS. At least two loading screws are mounted on the board. Theloading screws are received respectively in a corresponding pair of theperipheral, spaced apertures on opposite sides of the heatsink base. Atleast two latching mechanisms include a mounting portion and a latchingsurface. The mounting portion is mounted to the board. the mountingportion is received respectively in another corresponding pair of theperipheral, spaced apertures on opposites sides of the heatsink base.The latching surface is mounted to one of (i) the heatsink base toengage the mounting portion extending through the correspondingperipheral, spaced aperture as the heatsink base is lowered to anengagement height relative to the board and (ii) a terminal portion ofthe mounting portion to engage an upper edge of the correspondingperipheral, spaced aperture of the heatsink base. At least two loadingnuts engage a corresponding one of the at least two loading screws. Theat least two loading screws are each sized to be engageable by the atleast two loading nuts when the heatsink base is positioned not higherthan the engagement height. The engaged latching mechanisms preventtipping of the heatsink base during loading of the at least two loadingscrews with the at least two loading nuts.

According to illustrative embodiments of the present disclosure, amethod is provided for automated assembling of an IHS board. In one ormore embodiments, the method includes forming peripheral, spacedapertures in a heatsink base. The method includes attaching at least twoloading screws around a processor on a board of an IHS and positioned tobe received respectively in a corresponding pair of the peripheral,spaced apertures on opposite sides of the heatsink base. The methodincludes attaching a mounting portion of a respective one of at leasttwo latching mechanisms to the board positioned to be receivedrespectively in another corresponding pair of the peripheral, spacedapertures on opposites sides of the heatsink base. The method includesmaking a latching surface of the respective one of at least two latchingmechanisms by a selected one of two approaches: First, the method caninclude (i) attaching the latching surface to the heatsink base toengage the mounting portion extending through the correspondingperipheral, spaced aperture as the heatsink base is lowered to anengagement height relative to the board. Second, method can include (ii)forming the latching surface on a terminal portion of the mountingportion to engage an upper edge of the corresponding peripheral, spacedaperture of the heatsink base. The method includes positioning theheatsink base over the processor to an engagement position wherein thelatching surface is engaged. The method includes engaging at least twoloading nuts to a corresponding one of the at least two loading screws.The at least two loading screws are each sized to be engageable by theat least two loading nuts when the heatsink base is positioned nothigher than the engagement height. The engaged at least two latchingmechanisms prevent tipping of the heatsink base during loading of the atleast two loading screws with the loading nuts.

The above presents a general summary of several aspects of thedisclosure in order to provide a basic understanding of at least someaspects of the disclosure. The above summary contains simplifications,generalizations and omissions of detail and is not intended as acomprehensive description of the claimed subject matter but, rather, isintended to provide a brief overview of some of the functionalityassociated therewith. The summary is not intended to delineate the scopeof the claims, and the summary merely presents some concepts of thedisclosure in a general form as a prelude to the more detaileddescription that follows. Other systems, methods, functionality,features and advantages of the claimed subject matter will be or willbecome apparent to one with skill in the art upon examination of thefollowing figures and detailed written description.

BRIEF DESCRIPTION OF THE DRAWINGS

The description of the illustrative embodiments can be read inconjunction with the accompanying figures. It will be appreciated thatfor simplicity and clarity of illustration, elements illustrated in thefigures have not necessarily been drawn to scale. For example, thedimensions of some of the elements are exaggerated relative to otherelements. Embodiments incorporating teachings of the present disclosureare shown and described with respect to the figures presented herein, inwhich:

FIG. 1 illustrates a block diagram of an information handling system(IHS) having a heatsink retention apparatus assembled on a IHS board byan automated manufacturing system, according to one or more embodiments;

FIG. 2A illustrates an isometric view of a first example heatsinkapparatus with a heatsink base positioned at a disengaged position abovea board mechanical assembly attached to an IHS board around a centralprocessing unit (CPU) socket, according to one or more embodiments;

FIG. 2B illustrates a side view of the first example heatsink retentionapparatus of FIG. 2A, according to one or more embodiments;

FIG. 2C illustrates a front view in cross section of the first exampleheatsink retention apparatus of FIG. 2B taken along lines D-D, accordingto one or more embodiments;

FIG. 3A illustrates an isometric view of the first example heatsinkretention apparatus with the heatsink base in a lowered but stilldisengaged position to the board mechanical assembly, according to oneor more embodiments;

FIG. 3B illustrates a side view of the first example heatsink retentionapparatus of FIG. 3A, according to one or more embodiments;

FIG. 3C illustrates a front view in cross section of the first exampleheatsink retention apparatus of FIG. 3B taken along lines E-E, accordingto one or more embodiments;

FIG. 4A illustrates an isometric view of the first example heatsinkretention apparatus with the heatsink base lowered to an engagedposition to the board mechanical assembly enabling loading of captiveloading nuts to loading screws, according to one or more embodiments;

FIG. 4B illustrates a side view of the first example heatsink retentionapparatus of FIG. 4A, according to one or more embodiments;

FIG. 4C illustrates a front view in cross section of the first exampleheatsink retention apparatus of FIG. 4B taken along lines F-F, accordingto one or more embodiments;

FIG. 5A illustrates an isometric view of a second example heatsinkretention apparatus with a handle of the heatsink base positioned at adisengaged position above a board mechanical assembly, according to oneor more embodiments;

FIG. 5B illustrates a side view of the second example heatsink retentionapparatus of FIG. 5A, according to one or more embodiments;

FIG. 5C illustrates a front view in cross section of the second exampleheatsink retention apparatus of FIG. 5B taken along lines G-G, accordingto one or more embodiments;

FIG. 6A illustrates an isometric view of the second example heatsinkretention apparatus with the handle of the heatsink base rotated closerto a heatsink by ramping contact with a mounting stud, according to oneor more embodiments;

FIG. 6B illustrates a side view of the second example heatsink retentionapparatus of FIG. 6A, according to one or more embodiments;

FIG. 6C illustrates a front view in cross section of the second exampleheatsink retention apparatus of FIG. 6B taken along lines H-H, accordingto one or more embodiments;

FIG. 7A illustrates an isometric view of the second example heatsinkretention apparatus with the handle of the heatsink base fully rotatedtoward the heatsink by further ramping contact with the mounting stud,according to one or more embodiments;

FIG. 7B illustrates a side view of the second example heatsink retentionapparatus of FIG. 7A, according to one or more embodiments;

FIG. 7C illustrates a front view in cross section of the second exampleheatsink retention apparatus of FIG. 7B taken along lines I-I, accordingto one or more embodiments;

FIG. 8A illustrates an isometric view of the second example heatsinkretention apparatus with the handle of the heatsink base rotating awayfrom the heatsink as a latching surface engages a groove in the mountingstud, enabling loading of two captive load nuts, according to one ormore embodiments;

FIG. 8B illustrates a side view of the second example heatsink retentionapparatus of FIG. 8A, according to one or more embodiments;

FIG. 8C illustrates a front view in cross section of the second exampleheatsink retention apparatus of FIG. 8B taken along lines J-J, accordingto one or more embodiments;

FIG. 9 illustrates a flow diagram of a method of automated assembling ofan IHS board, according to one or more embodiments;

FIG. 10 illustrates a flow diagram of a method of making a continuousmechanical cantilever beam with latching surface for a first exampleheat sink apparatus, according to one or more embodiments; and

FIG. 11 illustrates a flow diagram of a method of making a secondexample heat sink apparatus utilizing a spring-biased latching arm,according to one or more embodiments.

DETAILED DESCRIPTION

A heatsink retention apparatus and method of automated assembly of aninformation handling system (IHS) board for an IHS that prevents tippingof a heatsink during mounting to a central processing unit (CPU), andthus prevent damage to the CPU socket by incorporating an automaticlatching mechanism. In one embodiment, the latching mechanism includes acontinuous mechanical cantilevered beam that passes through an aperturein the heatsink base and engages an upper edge of the aperture. In oneembodiment, the latching mechanism is a latching arm mounted to theheatsink base that allows a mounting stud to pass through an aperture inthe heatsink base. When the heatsink base is fully seated on the CPU,the fully inserted mounting stud exposes a mounting feature such as agroove that receives the spring-loaded latching arm for engagement.Positioning of a heatsink base onto the CPU causes at least two latchingmechanisms to automatically engage between the heatsink base and theboard. Loading of at least two loading screws can only occur after theengagement of the at least two latching mechanisms. Tipping of theheatsink base by loading a first of the at least two loading screws isprevented by the at least two latching mechanisms.

In the following detailed description of exemplary embodiments of thedisclosure, specific exemplary embodiments in which the disclosure maybe practiced are described in sufficient detail to enable those skilledin the art to practice the disclosed embodiments. For example, specificdetails such as specific method orders, structures, elements, andconnections have been presented herein. However, it is to be understoodthat the specific details presented need not be utilized to practiceembodiments of the present disclosure. It is also to be understood thatother embodiments may be utilized and that logical, architectural,programmatic, mechanical, electrical and other changes may be madewithout departing from general scope of the disclosure. The followingdetailed description is, therefore, not to be taken in a limiting sense,and the scope of the present disclosure is defined by the appendedclaims and equivalents thereof.

References within the specification to “one embodiment,” “anembodiment,” “embodiments”, or “one or more embodiments” are intended toindicate that a particular feature, structure, or characteristicdescribed in connection with the embodiment is included in at least oneembodiment of the present disclosure. The appearance of such phrases invarious places within the specification are not necessarily allreferring to the same embodiment, nor are separate or alternativeembodiments mutually exclusive of other embodiments. Further, variousfeatures are described which may be exhibited by some embodiments andnot by others. Similarly, various requirements are described which maybe requirements for some embodiments but not other embodiments.

It is understood that the use of specific component, device and/orparameter names and/or corresponding acronyms thereof, such as those ofthe executing utility, logic, and/or firmware described herein, are forexample only and not meant to imply any limitations on the describedembodiments. The embodiments may thus be described with differentnomenclature and/or terminology utilized to describe the components,devices, parameters, methods and/or functions herein, withoutlimitation. References to any specific protocol or proprietary name indescribing one or more elements, features or concepts of the embodimentsare provided solely as examples of one implementation, and suchreferences do not limit the extension of the claimed embodiments toembodiments in which different element, feature, protocol, or conceptnames are utilized. Thus, each term utilized herein is to be given itsbroadest interpretation given the context in which that terms isutilized.

FIG. 1 illustrates a block diagram representation of an exampleinformation handling system (IHS) 100 that has a heatsink retentionapparatus 102. Within the general context of IHSs, an IHS 100 mayinclude any instrumentality or aggregate of instrumentalities operableto compute, classify, process, transmit, receive, retrieve, originate,switch, store, display, manifest, detect, record, reproduce, handle, orutilize any form of information, intelligence, or data for business,scientific, control, entertainment, or other purposes. For example, anIHS may be a personal computer, a PDA, a consumer electronic device, anetwork storage device, or any other suitable device and may vary insize, shape, performance, functionality, and price. The IHS may includememory, one or more processing resources such as a CPU or hardware orsoftware control logic. Additional components or the IHS may include oneor more storage devices, one or more communications ports forcommunicating with external devices as well as various input and output(I/O) devices, such as a keyboard, a mouse, and a video display. The IHSmay also include one or more buses operable to transmit communicationbetween the various hardware components. It is appreciated that the IHSdescribed within the present disclosure is a Large-Scale InformationHandling System (LIHS), with servers acting as the individual processingunits.

IHS 100 includes at least one CPU or processor/s 112 coupled to a systemmemory 114 via a system interconnect 116. Due to the thermal energygenerating characteristics of the processor/s 112, the processor/s 112are mounted to a heatsink 115 to absorb and transfer the excess thermalenergy. System interconnect 116 can be interchangeably referred to as asystem bus, in one or more embodiments. Also coupled to systeminterconnect 116 is non-volatile storage (e.g., a non-volatile randomaccess memory (NVRAM)) 118, within which can be stored one or moresoftware and/or firmware modules and one or more sets of data that canbe utilized during management operations of IHS 100. These one or moresoftware and/or firmware modules can be loaded into system memory 114during operation of management IHS 100. Specifically, in one embodiment,system memory 114 can include therein a plurality of such modules,including one or more of firmware (F/W) 120, basic input/output system(BIOS) or Uniform Extensible Firmware Interface (UEFI) 122, operatingsystem (OS) 124, and application(s) 126. These software and/or firmwaremodules have varying functionality when their corresponding program codeis executed by processor 112 or secondary processing devices withinmanagement IHS 100. For example, application(s) 126 may include a wordprocessing application, a presentation application, and/or a managementstation application, among other applications.

IHS 100 further includes one or more input/output (I/O) controllers 130which support connection by, and processing of, signals from one or moreconnected input device(s) 132, such as a keyboard, mouse, touch screen,or microphone. I/O controllers 130 also support connection to, andforwarding of, output signals to one or more connected output devices134, such as a monitor or display device or audio speaker(s).Additionally, in one or more embodiments, one or more device interfaces136, such as an optical reader, a USB, a card reader, Personal ComputerMemory Card International Association (PCMCIA) slot, and/or ahigh-definition multimedia interface (HDMI), can be associated with IHS100. Device interface(s) 136 can be utilized to enable data to be readfrom, or stored to, corresponding removable storage device(s) 138, suchas a compact disk (CD), digital video disk (DVD), flash drive, or flashmemory card. In one or more embodiments, device interface(s) 136 canfurther include general purpose I/O interfaces such as inter-integratedcircuit (I²C), system management bus (SMB), and peripheral componentinterconnect (PCI) buses.

IHS 100 comprises a network interface controller (NIC) 140. NIC 140enables IHS 100 and/or components within IHS 100 to communicate and/orinterface with other devices, services, and components that are locatedexternal to IHS 100. These devices, services, and components caninterface with IHS 100 via an external network, such as example network142. According to one aspect of the disclosure, NIC 140 represents acommunication mechanism that enables the IHS to communicate with one ormore clients, as described in greater detail hereinafter. Network 142can be a local area network, wide area network, personal area network,and the like, and the connection to and/or between network 142 and IHS100 can be wired or wireless or a combination thereof. For purposes ofdiscussion, network 142 is indicated as a single collective componentfor simplicity. However, it should be appreciated that network 142 cancomprise one or more direct connections to other devices as well as amore complex set of interconnections as can exist within a wide areanetwork, such as the Internet.

IHS 100 further includes heatsink retention apparatus 102. Heatsinkretention apparatus 102 can include a board mechanical assembly 144 thatis attached to an IHS board 146 around CPU socket/s 148 that eachcontain at least one processor 112. The board mechanical assembly 144includes mounting portions 150 a-150 b of the heatsink retentionapparatus 102 that are received with peripheral, spaced apertures 152vertically formed around a periphery of a heatsink base 158 thatsupports a heatsink 115. Mounting portions 150 a-150 b surround an areaof IHS board 146 that contains CPU socket/s 148. At least two loadingscrews 156 are also attached to board mechanical assembly 144 andaligned to pass through corresponding peripheral, spaced apertures 152for loading engagement by captive loading nuts 153. A latching surface154 a-154 b forms an engagement between corresponding mounting portions150 a-150 b and heatsink base 158.

In one embodiment, mounting portion 150 a and latching surface 154 a areattached as part of a continuous mechanical cantilever beam 160 formedfrom an elastic material such as a polymer plastic. Mounting portion 150a has a ramped tip 162 that is aligned to enter the correspondingperipheral, spaced aperture 152. With further insertion, the ramped tip162 is deflected by a contacting side of peripheral, spaced aperture152. With continued insertion, the ramped tip 162 reaches an engagementposition exposing latching surface 154 a above heatsink base 158. At theengagement position, the latching surface 154 a engages an upper surfaceof heatsink base 158 proximate to the corresponding peripheral, spacedaperture 152. In an exemplary embodiment, two continuous mechanicalcantilever beams 160 are positioned on opposite corners of boardmechanical assembly 144. Thus, manual removal of heatsink base 158 canbe enabled by manually deflecting each latching surface 154 a fromengagement with the upper edge of the corresponding peripheral, spacedaperture 152. Rigid mounting guides 255 (FIG. 2A) can be attached toboard mechanical assembly 144 and aligned to pass through otherperipheral, spaced apertures 152, such as the other two opposite cornersfor a rectangularly shaped heatsink base 158.

In one embodiment, mounting portion 150 b can be part of a rigidmounting stud 164 formed of metal and having a tapered, conical tip 166above an engagement feature 168 such as an annular groove. The tapered,conical tip 166 can enter a corresponding, slightly off-centerperipheral, spaced aperture 152 and cause centering of the heatsink base158 as the closely fitting mounting portion 150 b enters thecorresponding peripheral, spaced aperture 152. Latching surface 154 b isprovided by a latching arm 170 that is pinned to a side of heatsink base158. Latching arm 170 is biased by a horizontal compression spring 172in contact with conical tip 166 of mounting stud 164.

For clarity, FIG. 1 illustrates two embodiments of a heatsink retentionapparatus 102. Due to clearance of other design issues, such variationscan coexist for a particular IHS board 146. In other embodiments, asingular type of heatsink retention apparatus 102 would be used forcertain IHS boards 146. In addition, certain embodiments of a heatsinkretention apparatus 102 can lend themselves to manual use as compared toautomated or robotic fabrication and assembly. Each embodiment does notrely on a procedure to avoid inadvertent damage during manualinstallation of a heatsink 115. The automatic engagement can also assistin automated assembly. The heatsink base 158 need not be held whenswitching to a means of fastening the locking screws 156. For example,an automated manufacturing controller 178 of an automated manufacturingsystem 180 can respond to an order 182 by executing instructions thatdirects assembly of at least an IHS board 146 of the IHS 100. Automatedmanufacturing controller 178 can select an appropriate board mechanicalassembly 144 and heatsink base 158 from an automated inventory system184 according to the order 182. A robotic assembly system 186 caninclude a manipulator 188 that sequentially positions the boardmechanical assembly 144 and heatsink base 158 within a chassis 190 ofIHS 100 and fastens board mechanical assembly 144 and heatsink base 158to IHS board 146 using a fastener tool 192.

FIGS. 2A-2C, 3A-3C, and 4A-4C illustrate a heatsink retention apparatus202 having two or more continuous mechanical cantilever beams 260 thatautomatically engage square apertures 252 a on two opposite corners of aheatsink base 258 having a heatsink 215. The other two corners haveround apertures 252 b that receive rigid mounting guides 255 to assistin centering the heatsink base 258. Continuous cantilever beams 260 andrigid mounting guides 255 are attached to a board mechanical assembly244 that in turn is fastened to IHS board 246. Board mechanical assembly244 surrounds CPU socket 248. FIGS. 2A-2C illustrate heatsink base 258lowered to a first position relative to IHS board 246. The guidingfeatures, such as ramped tip 262 of cantilever beam 260 and mountingguides 255, begin to enter corresponding apertures 252 a-252 b,respectively, in the heatsink base 258. Latching surface 254 a ispositioned close to an outward edge of the corresponding peripheral,spaced aperture 252 a. Heatsink base 258 is spaced above CPU socket 248that supports a processor 212 (FIG. 2A). Loading screws 256 are spacedfarther away from heatsink base 258 and cannot engage captive loadingnuts 253.

FIGS. 3A-3C illustrate heatsink base 258 lowered to a second positioncloser to IHS board 246 than the first position. Mechanical cantileverbeams 260 are elastically urged into deflecting contact with thecorresponding peripheral, spaced aperture 252 a. Heatsink base 258 isaligned for contact with CPU socket 248.

FIGS. 4A-4C illustrate heatsink base 258 lowered to a third position, or“engagement position”, closer to IHS board 246 than the second position.Heatsink base 258 and the associated assembly with processor 212 arepositioned at the engagement height, such that (i) CPU contacts arestarted, (ii) heatsink-to-CPU thermal interface has started, and (iii)and final loading can begin. Latching surface 254 a extends aboveaperture 252 a and can passively and automatically engage heatsink base258. At the engagement position, loading screws 256 contact captiveloading nuts 253. With heatsink base 258 held at two opposite corners tothe IHS board 246, loading nuts 253 can be fastened to correspondingloading screws 256, creating a loaded condition between heatsink base258, processor 212, and CPU socket 248 thereby enhancing thermalconduction to heatsink 215. With the heatsink/cpu assembly now preventedfrom tipping by the heatsink retention apparatus 202, one loading nut253 can be individually, fully tightened without causing damage. Aprocedure is not required to tighten each loading nut 253 only a portionof the travel at a time in a sequence.

FIGS. 5A-5C, 6A-6C, 7A-7C and 8A-8C illustrate different embodiments ofa heatsink retention apparatus 502 having a first pair of spring-loadedlatch arms 570 pinned for pivoting movement on opposite sides ofheatsink base 558, which supports heatsink 515. Each latch arm 570 has alatching surface 554. First pair of spring-loaded latch arms 570 are oneach end of a first lateral side of heatsink base 558 and are alignedfor rotational movement about a first horizontal axis that is parallelto the first lateral side. A first actuator lever member 571 is attachedbetween first pair of spring-loaded latch arms 570. The first actuatorlever member 571 is movable to simultaneously engage and disengage eachof the first pair of spring-loaded latching arms 570 from thecorresponding engagement feature 568 of the corresponding one of themounting studs 564. A compression spring 572 is positioned betweenactuator lever member 571 and heatsink 515. Compression spring 572provides spring loading to the latching arms 570. Mounting studs 564 arealigned with corresponding peripheral, spaced apertures 552 in heatsinkbase 558. Mounting studs 564 are attached to a board mechanical assembly544 that in turn is fastened to IHS board 546. Board mechanical assembly544 surrounds CPU socket (148, FIG. 1). FIGS. 5A-5C illustrate theheatsink base 558 positioned for conical tips 566 of mounting studs 564to begin to enter corresponding spaced apart apertures 552. FIGS. 6A-6Cillustrate heatsink base 558 positioned lower for conical tips 566 ofmounting studs 564 to begin to deflect latching arms 570 away fromaperture 552. FIGS. 7A-7C illustrate heatsink base 558 positioned stilllower, with engagement feature 568 still below latching arm 570 andloading screws 556 still not contacting captive loading nuts 553. FIGS.8A-8C illustrate heatsink base 558 and the associated assembly withprocessor positioned at the engagement height, such that (i) CPUcontacts are started, (ii) heatsink-to-CPU thermal interface hasstarted, and (iii) and final loading can begin. Engagement feature 568has engaged latching arm 570. Loading screws 556 are contacting captiveloading nuts 553 and can be applied in any sequence. With theheatsink/cpu assembly now prevented from tipping by the heatsinkretention apparatus 502, one loading nut 553 can be individually, fullytightened without causing damage. A procedure is not required to tighteneach loading nut 553 only a portion of the travel at a time in asequence. Screw disassembly can be in any sequence. Also, a user mustintentionally depress lever member 571 toward heatsink 515 to unlatchlatching arms 570 from mounting studs 564, and lift heatsink base 558away from load screws 556.

For clarity, only two adjacent corners are engaged by spring-loadedlatching arms 570. In one or more embodiments, which are notillustrated, a mirrored identical second pair of the spring-loaded latcharms are pinned for pivoting movement on the opposite sides of theheatsink base. The second pair of the spring-loaded latch arms would beon each end of a second lateral side of the heatsink base. The secondpair of the spring-loaded latch arms would be aligned for rotationalmovement about a second horizontal axis that is parallel to the secondlateral side and the first horizontal axis. A second actuator levermember is attached between the second pair of spring-loaded latch arms.The second actuator lever member is movable to simultaneously engage anddisengage each of the second pair of spring-loaded arms from thecorresponding engagement feature of the corresponding one of themounting studs.

FIGS. 9-11 illustrate flowcharts of exemplary methods 900, 1000, and1100 by which an automated manufacturing controller 178 (FIG. 1)performs different aspects of the processes that enable the one or moreembodiments of the disclosure. Generally, methods 900, 1000, and 1100represent a computer-implemented method. The description of methods 900,1000, and 1100 are provided with general reference to the specificcomponents illustrated within FIG. 1. Generally methods 900, 1000, and1100 are described as being implemented via processor 112 (FIG. 1). Themethods 900, 1000, and 1100 thereby provide automated assembling of anIHS board. It is however appreciated that certain aspects of thedescribed methods may be implemented via other processing devices and/orexecution of other code.

FIG. 9 illustrates a method 900 for automated assembling of an IHSboard. In one or more embodiments, method 900 includes formingperipheral, spaced apertures in a heatsink base (block 902). The method900 includes attaching at least two loading screws around a processor ona board of an IHS and positioning the screws to be received respectivelyin a corresponding pair of the peripheral, spaced apertures on oppositesides of the heatsink base (block 904). The method 900 includesattaching a mounting portion of a respective one of at least twolatching mechanisms to the board, the mounting portion positioned to bereceived respectively in another corresponding pair of the peripheral,spaced apertures on opposites sides of the heatsink base (block 906).The method 900 includes making a latching surface of the respective oneof the at least two latching mechanisms by a selected one of (i)attaching the latching surface to the heatsink base to engage themounting portion extending through the corresponding peripheral, spacedaperture as the heatsink base is lowered to an engagement heightrelative to the board; and (ii) forming the latching surface on aterminal portion of the mounting portion to engage an upper edge of thecorresponding peripheral, spaced aperture of the heatsink base (block908). The method 900 includes positioning the heatsink base over theprocessor to an engagement position where the latching surface isengaged (block 910). The method 900 includes engaging at least twoloading nuts (block 912). The at least two loading screws are each sizedto be engageable by the at least two loading nuts when the heatsink baseis positioned not higher than the engagement height. The engaged atleast two latching mechanisms prevent tipping of the heatsink baseduring loading of the at least two loading screws with the at least twospaced apart loading nuts. The method 900 ends.

FIG. 10 illustrates a method 1000 of making a first example heatsinkretention apparatus for an IHS board. In one or more embodiments, themethod 1000 includes forming from elastic material a continuousmechanical cantilever beam having a first end mountable on the board asa mounting portion and having a second end that includes a ramped pointdistal to the latching surface (block 1002). The method 1000 includesattaching the first end of the continuous mechanical cantilever beam toopposite corners of a board mechanical assembly (block 1004). Method1000 can further include mounting at least two mounting studs on theboard mechanical assembly on two other opposite corners, where the atleast two mounting studs are positioned to be received by an additionalpair of corresponding peripheral, spaced apertures on opposite sides ofthe heatsink base (block 1006). The method 1000 includes attaching theboard mechanical assembly to the IHS board surrounding CPU socket/s(block 1008). Then method 1000 ends.

FIG. 11 illustrates a method 1100 of making a second example heatsinkretention apparatus for an IHS board. In one or more embodiments, method1100 includes forming four rigid mounting studs, at least two of whichhave a conical tip above an engagement feature (block 1102). Forexample, the engagement feature can be an annular groove spaced abovethe IHS board to define an engagement height of the heatsink retentionapparatus. The method 1100 includes attaching mounting studs at fourcorners of the board mechanical assembly, each stud aligned with acorresponding peripheral, spaced aperture in a heatsink base (block1104). Method 1100 includes pivotally attaching a spring-loaded latchingarm having the latching surface to the heatsink base. The spring-loadedlatching arm is biased into engagement with the engagement feature ofthe mounting stud (block 1106). The method 1100 includes attaching asecond spring-loaded latching arm on an adjacent corner of the heatsinkbase (block 1108). A first pair of the two spring-loaded latch arms onopposite sides of the heatsink base are on each end of a first lateralside of the heatsink base, and aligned for rotational movement about afirst horizontal axis that is parallel to the first lateral side. Method1100 includes attaching a first actuator lever member between the firstpair of spring-loaded latch arms (block 1110). The first actuator levermembers are movable to simultaneously engage and disengage each of thefirst pair of spring-loaded arms from the corresponding engagementfeature of the corresponding one of the mounting studs. Then method 1100ends.

In the above described flow charts of FIGS. 9-11, one or more of themethods may be embodied in an automated manufacturing controller thatperforms a series of functional processes. In some implementations,certain steps of the methods are combined, performed simultaneously orin a different order, or perhaps omitted, without deviating from thescope of the disclosure. Thus, while the method blocks are described andillustrated in a particular sequence, use of a specific sequence offunctional processes represented by the blocks is not meant to imply anylimitations on the disclosure. Changes may be made with regards to thesequence of processes without departing from the scope of the presentdisclosure. Use of a particular sequence is therefore, not to be takenin a limiting sense, and the scope of the present disclosure is definedonly by the appended claims.

One or more of the embodiments of the disclosure described can beimplementable, at least in part, using a software-controlledprogrammable processing device, such as a microprocessor, digital signalprocessor or other processing device, data processing apparatus orsystem. Thus, it is appreciated that a computer program for configuringa programmable device, apparatus or system to implement the foregoingdescribed methods is envisaged as an aspect of the present disclosure.The computer program may be embodied as source code or undergocompilation for implementation on a processing device, apparatus, orsystem. Suitably, the computer program is stored on a carrier device inmachine or device readable form, for example in solid-state memory,magnetic memory such as disk or tape, optically or magneto-opticallyreadable memory such as compact disk or digital versatile disk, flashmemory, etc. The processing device, apparatus or system utilizes theprogram or a part thereof to configure the processing device, apparatus,or system for operation.

While the disclosure has been described with reference to exemplaryembodiments, it will be understood by those skilled in the art thatvarious changes may be made and equivalents may be substituted forelements thereof without departing from the scope of the disclosure. Inaddition, many modifications may be made to adapt a particular system,device or component thereof to the teachings of the disclosure withoutdeparting from the essential scope thereof. Therefore, it is intendedthat the disclosure not be limited to the particular embodimentsdisclosed for carrying out this disclosure, but that the disclosure willinclude all embodiments falling within the scope of the appended claims.Moreover, the use of the terms first, second, etc. do not denote anyorder or importance, but rather the terms first, second, etc. are usedto distinguish one element from another.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the disclosure.As used herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

The description of the present disclosure has been presented forpurposes of illustration and description, but is not intended to beexhaustive or limited to the disclosure in the form disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope of the disclosure. Thedescribed embodiments were chosen and described in order to best explainthe principles of the disclosure and the practical application, and toenable others of ordinary skill in the art to understand the disclosurefor various embodiments with various modifications as are suited to theparticular use contemplated.

What is claimed is:
 1. An information handling system (IHS) comprising: a heatsink retention apparatus comprising: a heatsink base having peripheral, spaced apertures; a board having at least two peripheral, spaced loading screws mounted thereon, the loading screws received respectively in a corresponding pair of the peripheral, spaced apertures of the heatsink base; at least two latching mechanisms comprising: a mounting portion mounted to the board and received respectively in another corresponding pair of the peripheral, spaced apertures of the heatsink base; a first pair of spring-loaded latch arms pinned for pivoting movement on opposite sides of the heatsink base on each end of a first lateral side of the heatsink base and aligned for rotational movement about a first horizontal axis that is parallel to the first lateral side; and a latching surface that is mounted to one of (i) the heatsink base to engage the mounting portion extending through the corresponding peripheral, spaced aperture as the heatsink base is lowered to an engagement height relative to the board and (ii) a terminal portion of the mounting portion to engage an upper edge of the corresponding peripheral, spaced aperture of the heatsink base; and at least two peripheral, spaced loading nuts that engage for loading a corresponding one of the at least two peripheral, spaced loading screws, the at least two peripheral, spaced loading screws each sized to be engageable by the at least two peripheral, spaced loading nuts when the heatsink base is positioned not higher than the engagement height, the engaged at least two latching mechanisms preventing tipping of the heatsink base during loading of the at least two peripheral, spaced loading screws with the at least two spaced apart loading nuts.
 2. The IHS of claim 1, wherein the mounting portion of each of the at least two latching mechanisms comprises a continuous mechanical cantilever beam having a first end mounted on the board and a second end that includes a ramped point distal to the latching surface, the continuous mechanical cantilever beam elastically urge the latching surface into engagement with the upper edge surrounding the corresponding peripheral, spaced aperture.
 3. The IHS of claim 2, further comprising at least two mounting studs mounted on the board and received by an additional pair of corresponding peripheral, spaced apertures on opposite sides of the heatsink base; wherein the two continuous mechanical cantilever beams are simultaneously disengageable from the upper edge from the heatsink base enabling removal of the heatsink base from the board guided by the at least two mounting studs.
 4. The IHS of claim 1, wherein: the latching surface comprises a spring-loaded latch arm pivotally attached to the heatsink base and biased into engagement with an engagement feature of a mounting stud mounted on the board.
 5. The IHS of claim 1, wherein the at least two latching mechanisms comprise: a first actuator lever member attached between the first pair of spring-loaded latch arms and movable to simultaneously engage and disengage each of the first pair of spring-loaded arms from a corresponding engagement feature of a corresponding one of a pair of mounting studs mounted on the board.
 6. The IHS of claim 1, wherein the at least two latching mechanisms further comprise: a second pair of spring-loaded latch arms pinned for pivoting movement on the opposite sides of the heatsink base on each end of a second lateral side of the heatsink base and aligned for rotational movement about a second horizontal axis that is parallel to the second lateral side and the first horizontal axis; and a second actuator lever member attached between the second pair of spring-loaded latch arms and movable to simultaneously engage and disengage each of the second pair of spring-loaded arms from a corresponding engagement feature of a corresponding one of a pair of mounting studs mounted on the board.
 7. A heatsink retention apparatus comprising: a heatsink base having peripheral, spaced apertures; at least two peripheral, spaced loading screws mounted on a board of an information handling system (IHS) and received respectively in a corresponding pair of the peripheral, spaced apertures of the heatsink base; at least two latching mechanisms comprising: a mounting portion mounted to the board and received respectively in another corresponding pair of the peripheral, spaced apertures of the heatsink base; a first pair of spring-loaded latch arms pinned for pivoting movement on opposite sides of the heatsink base on each end of a first lateral side of the heatsink base and aligned for rotational movement about a first horizontal axis that is parallel to the first lateral side; and a latching surface that is mounted to one of (i) the heatsink base to engage the mounting portion extending through the corresponding peripheral, spaced aperture as the heatsink base is lowered to an engagement height relative to the board and (ii) a terminal portion of the mounting portion to engage an upper edge of the corresponding peripheral, spaced aperture of the heatsink base; and at least two peripheral, spaced loading nuts that engage for loading a corresponding one of the at least two peripheral, spaced loading screws, the at least two peripheral, spaced loading screws each sized to be engageable by the at least two peripheral, spaced loading nuts when the heatsink base is positioned not higher than the engagement height, the engaged at least two latching mechanisms preventing tipping of the heatsink base during loading of the at least two peripheral, spaced loading screws with the at least two spaced apart loading nuts.
 8. The heatsink retention apparatus of claim 7, wherein the mounting portion of each of the at least two latching mechanisms comprises a continuous mechanical cantilever beam having a first end mounted on the board and a second end that includes a ramped point distal to the latching surface, the continuous mechanical cantilever beam elastically urge the latching surface into engagement with the upper edge surrounding the corresponding peripheral, spaced aperture.
 9. The heatsink retention apparatus of claim 8, further comprising: at least two mounting studs mounted on the board and received by an additional pair of corresponding peripheral, spaced apertures on opposite sides of the heatsink base; and wherein the two continuous mechanical cantilever beams are simultaneously disengageable from the upper edge from the heatsink base enabling removal of the heatsink base from the board guided by at the least two mounting studs.
 10. The heatsink retention apparatus of claim 7, wherein: the mounting portion of each of the at least two latching mechanisms comprises a mounting stud having an engagement feature that is exposed above the corresponding peripheral, spaced aperture with the heatsink base at the engagement height; and the latching surface comprises a spring-loaded latch arm pivotally attached to the heatsink base and biased into engagement with an engagement feature of the mounting stud mounted on the board.
 11. The heatsink retention apparatus of claim 7, wherein the at least two latching mechanisms comprise: a first actuator lever member attached between the first pair of spring-loaded latch arms and movable to simultaneously engage and disengage each of the first pair of spring-loaded arms from a corresponding engagement feature of a corresponding one of the mounting studs.
 12. The heatsink retention apparatus of claim 7, wherein the at least two latching mechanisms further comprise: a second pair of spring-loaded latch arms pinned for pivoting movement on the opposite sides of the heatsink base on each end of a second lateral side of the heatsink base and aligned for rotational movement about a second horizontal axis that is parallel to the second lateral side and the first horizontal axis; and a second actuator lever member attached between the second pair of spring-loaded latch arms and movable to simultaneously engage and disengage each of the second pair of spring-loaded arms from the corresponding engagement feature of the corresponding one of the mounting studs.
 13. A method of automated assembling of an information handling system (IHS) board, the method comprising: forming peripheral, spaced apertures in a heatsink base; attaching at least two peripheral, spaced loading screws around a processor on a board of an IHS and positioned to be received respectively in a corresponding pair of the peripheral, spaced apertures on opposite sides of the heatsink base; attaching a mounting portion of a respective one of at least two latching mechanisms to the board positioned to be received respectively in another corresponding pair of the peripheral, spaced apertures on opposites sides of the heatsink base; pinning for pivoting movement a first pair of spring-loaded latch arms on opposite sides of the heatsink base, on each end of a first lateral side of the heatsink base, and aligned for rotational movement about a first horizontal axis that is parallel to the first lateral side; making a latching surface of the respective one of at least two latching mechanisms by a selected one of: (i) attaching the latching surface to the heatsink base to engage the mounting portion extending through the corresponding peripheral, spaced aperture as the heatsink base is lowered to an engagement height relative to the board; and (ii) forming the latching surface on a terminal portion of the mounting portion to engage an upper edge of the corresponding peripheral, spaced aperture of the heatsink base; positioning the heatsink base over the processor to an engagement position wherein the latching surface is engaged; and engaging at least two peripheral, spaced loading nuts to a corresponding one of the at least two peripheral, spaced loading screws, the at least two peripheral, spaced loading screws each sized to be engageable by the at least two peripheral, spaced loading nuts when the heatsink base is positioned not higher than the engagement height, the engaged at least two latching mechanisms preventing tipping of the heatsink base during loading of the at least two peripheral, spaced loading screws with the at least two spaced apart loading nuts.
 14. The method of claim 13, wherein the mounting portion of each of the at least two latching mechanisms comprises a continuous mechanical cantilever beam having a first end mounted on the board and a second end that includes a ramped point distal to the latching surface, the continuous mechanical cantilever beam elastically urge the latching surface into engagement with the upper edge surrounding the corresponding peripheral, spaced aperture.
 15. The method of claim 14, further comprising mounting at least two mounting studs mounted on the board positioned to be received by an additional pair of corresponding peripheral, spaced apertures on opposite sides of the heatsink base.
 16. The method of claim 15, further comprising deflecting the two continuous mechanical cantilever beams to simultaneously disengage from the upper edge from the heatsink base while raising the heatsink base away from the board guided by the at least two mounting studs for replacing the heatsink base.
 17. The method of claim 13, wherein: mounting the mounting portion comprises forming a mounting stud having an engagement feature that is exposed above the corresponding peripheral, spaced aperture with the heatsink base at the engagement height; and attaching the latching surface comprises pivotally attaching the spring-loaded latch arm to the heatsink base and biasing the spring-loaded latch arm into engagement with the engagement feature of the mounting stud.
 18. The method of claim 13, wherein attaching the at least two latching mechanisms comprises: attaching a first actuator lever member between the first pair of spring-loaded latch arms and movable to simultaneously engage and disengage each of the first pair of spring-loaded arms from the corresponding engagement feature of the corresponding one of the mounting studs.
 19. The method of claim 13, wherein attaching the at least two latching mechanisms further comprises: pinning for pivoting movement a second pair of spring-loaded latch arms on opposite sides of the heatsink base, on each end of a second lateral side of the heatsink base, and aligned for rotational movement about a second horizontal axis that is parallel to the first lateral side and parallel to the first horizontal axis; and attaching a second actuator lever member between the first pair of spring-loaded latch arms and movable to simultaneously engage and disengage each of the second pair of spring-loaded arms from the corresponding engagement feature of the corresponding one of the mounting studs.
 20. The method of claim 18, further comprising replacing a mounted heatsink by: unlocking a pair of loading nuts to disengage loading screws from the heatsink base; and deflecting the first actuator lever members toward the heatsink to disengage the spring-loaded latch arms from the engagement feature of the corresponding one of the mounting studs while simultaneously removing the heatsink base to replace a heatsink. 